STM32F105xx, STM32F107xx
Package characteristics
6.2
Thermal characteristics
The maximum chip junction temperature (T max) must never exceed the values given in
J
Table 9: General operating conditions on page 34.
The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated
J
using the following equation:
T max = T max + (P max × S )
J
A
D
JA
Where:
G
G
G
G
T max is the maximum ambient temperature in flC,
A
S
is the package junction-to-ambient thermal resistance, in flC/W,
JA
P max is the sum of P
D
max and P max (P max = P
I/O
max + P max),
INT I/O
INT
D
P
internal power.
max is the product of I and V , expressed in Watts. This is the maximum chip
DD DD
INT
P
max represents the maximum power dissipation on output pins where:
I/O
P
max = U"(V × I ) + U((V – V ) × I ),
OL OL DD OH OH
I/O
taking into account the actual V / I and V / I of the I/Os at low and high level in the
OH OH
OL OL
application.
Table 59. Package thermal characteristics
Symbol
Parameter
Value
Unit
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
SJA
°C/W
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Doc ID 15274 Rev 4
79/95
STMICROELECTRONICS [ ST ]
