Package characteristics
STM32F103x8, STM32F103xB
Figure 49. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
package outline
Z Seating plane
ddd Z
A4 A3 A2
E1
e
F
A1 A
A1 ball
A1 ball
identifier index area
X
E
A
F
D1
e
Y
M
12
BOTTOM VIEW
1
D
Øb (100 balls)
Ø eee
M
Z Y X
Ø fff
M
Z
TOP VIEW
A0C2_ME_V2
1. Drawing is not to scale.
Table 55.
UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data
millimeters
inches
(1)
Max
0.600
0.110
0.500
0.180
0.370
0.300
7.050
5.550
7.050
5.550
Min
0.0181
0.0020
0.0157
0.0031
0.0106
0.0079
0.2736
0.2146
0.2736
0.2146
Typ
0.0209
0.0031
0.0177
0.0051
0.0126
0.0098
0.2756
0.2165
0.2756
0.2165
0.0197
0.800
0.100
0.150
0.050
0.0276
0.0295
0.0315
0.0039
0.0059
0.0020
Max
0.0236
0.0043
0.0197
0.0071
0.0146
0.0118
0.2776
0.2185
0.2776
0.2185
Symbol
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
0.700
0.460
0.050
0.400
0.080
0.270
0.200
6.950
5.450
6.950
5.450
Typ
0.530
0.080
0.450
0.130
0.320
0.250
7.000
5.500
7.000
5.500
0.500
0.750
1. Values in inches are converted from mm and rounded to 4 decimal digits.
88/105
Doc ID 13587 Rev 15
STMICROELECTRONICS [ STMICROELECTRONICS ]
