STM32F103C8T7 参数 Datasheet PDF下载

STM32F103x8, STM32F103xB

Package characteristics

Figure 43. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline

1. Drawing is not to scale.

2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to

the VSS or VDD power pads. It is recommended to connect it to VSS.

3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.

Table 52.

Symbol

UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data

millimeters

Min

Typ

0.550

0.020

7.000

7.000

0.400

0.152

0.200

0.250

0.500

0.080

0.300

0.0079

Max

0.600

0.050

7.100

7.100

0.500

Min

0.0197

0.0000

0.2717

0.2717

0.0118

inches

(1)

Typ

0.0217

0.0008

0.2756

0.2756

0.0157

0.0060

0.0098

0.0197

0.0031

0.0118

Max

0.0236

0.0020

0.2795

0.2795

0.0197

A

A1

D

E

L

T

b

e

ddd

0.500

0.000

6.900

6.900

0.300

Doc ID 13587 Rev 15

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