STM32F103x4, STM32F103x6
Package characteristics
Figure 40. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
2. There is an exposed die pad on the underside of the QFPN package, this pad is not internally connected to
the VSS or VDD power pads. It is recommended to connect it to VSS.
3. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 52.
Symbol
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data
millimeters
Min
Typ
0.550
0.020
7.000
7.000
0.400
0.152
0.200
0.250
0.500
0.080
0.300
0.0079
Max
0.600
0.050
7.100
7.100
0.500
Min
0.0197
0.0000
0.2717
0.2717
0.0118
inches
(1)
Typ
0.0217
0.0008
0.2756
0.2756
0.0157
0.0060
0.0098
0.0197
0.0031
0.0118
Max
0.0236
0.0020
0.2795
0.2795
0.0197
A
A1
D
E
L
T
b
e
ddd
0.500
0.000
6.900
6.900
0.300
Doc ID 15060 Rev 6
77/90
STMICROELECTRONICS [ STMICROELECTRONICS ]
