STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 72. Recommended footprint
(1)(2)
Figure 71. LQFP64 – 10 x 10 mm 64 pin low-profile
quad flat package outline
(1)
48
D
D1
D3
48
49
b
L1
E3 E1 E
33
32
ccc
C
A
A2
33
0.3
49
0.5
32
12.7
10.3
10.3
64
A1
L
K
17
1.2
1
16
7.8
64
17
Pin 1
identification
1
16
c
5W_ME
12.7
ai14909
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 72.
Symbol
LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data
millimeters
Min
Typ
Max
1.600
0.050
1.350
0.170
0.090
11.800
9.800
12.000
10.000
7.500
11.800
9.800
12.000
10.00
0.500
0°
0.450
3.5°
0.600
1.000
0.080
Number of pins
7°
0.75
0°
0.0177
12.200
10.200
0.4646
0.3858
0.4724
0.3937
0.0197
3.5°
0.0236
0.0394
0.0031
7°
0.0295
0.4803
0.4016
1.400
0.220
0.150
1.450
0.270
0.200
12.200
10.200
0.0020
0.0531
0.0067
0.0035
0.4646
0.3858
0.4724
0.3937
0.0551
0.0087
Min
inches
(1)
Typ
Max
0.0630
0.0059
0.0571
0.0106
0.0079
0.4803
0.4016
A
A1
A2
b
c
D
D1
D.
E
E1
e
k
L
L1
ccc
N
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 8
119/130
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