STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
(1)(2)
Figure 71. LQFP64 – 10 x 10 mm 64 pin low-profile
Figure 72. Recommended footprint
(1)
quad flat package outline
48
33
D
0.3
ccc
C
D1
D3
49
32
0.5
A
A2
33
48
32
49
12.7
10.3
b
L1
E3 E1
E
10.3
64
17
L
A1
K
1.2
64
1
16
17
Pin 1
identification
7.8
1
16
c
5W_ME
12.7
ai14909
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 72. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
A1
A2
b
1.600
0.150
1.450
0.270
0.200
12.200
10.200
0.0630
0.0059
0.0571
0.0106
0.0079
0.4803
0.4016
0.050
1.350
0.170
0.090
11.800
9.800
0.0020
0.0531
0.0067
0.0035
0.4646
0.3858
1.400
0.220
0.0551
0.0087
c
D
12.000
10.000
7.500
12.000
10.00
0.500
3.5°
0.4724
0.3937
D1
D.
E
11.800
9.800
12.200
10.200
0.4646
0.3858
0.4724
0.3937
0.0197
3.5°
0.4803
0.4016
E1
e
k
0°
7°
0°
7°
L
0.450
0.600
1.000
0.080
0.75
0.0177
0.0236
0.0394
0.0031
0.0295
L1
ccc
Number of pins
64
N
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 8
119/130
STMICROELECTRONICS [ ST ]
