STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 63. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
C
Seating
plane
A2
A4
A3
B
D
D1
e
M
F
F
A
A
A1
ddd
C
E1 E
e
Øb (144
balls)
Ball A1
Ø eee M C A
Ø fff M
C
B
X3_ME
1. Drawing is not to scale.
Table 66.
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
millimeters
inches
(1)
Max
1.70
0.21
1.07
0.27
0.85
0.35
9.85
0.40
10.00
8.80
9.85
10.00
8.80
0.80
0.60
0.10
0.15
0.08
10.15
0.3878
0.45
10.15
0.0138
0.3878
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
0.3996
0.0083
0.0421
0.0106
0.0335
0.0177
0.3996
Typ
Min
Max
0.0669
Symbol
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Typ
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 8
113/130
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