STM32F103xx
Electrical characteristics
Table 6.
Symbol
TSTG
TJ
Thermal characteristics
Ratings
Storage temperature range
Value
Unit
–65 to +150
°C
Maximum junction temperature (see Thermal characteristics)
5.3
Operating conditions
5.3.1
General operating conditions
Table 7.
Symbol
General operating conditions
Parameter
Conditions
Min
Max
Unit
fHCLK
fPCLK1
fPCLK2
VDD
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Backup operating voltage
0
0
72
36
MHz
0
72
2
3.6
3.6
105
V
V
VBAT
TA
1.8
−40
Ambient temperature range
°C
5.3.2
Operating conditions at power-up / power-down
The parameters given in Table 8 are derived from tests performed under the ambient
temperature condition summarized in Table 7.
Table 8.
Symbol
Operating conditions at power-up / power-down
Parameter
Conditions
Min Typ Max Unit
20
µs/V
tVDD
VDD rise/fall time rate
20 ms/V
27/67
STMICROELECTRONICS [ ST ]
