Package characteristics
STM32F103x8, STM32F103xB
Figure 52. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
Z Seating plane
ddd Z
A4
A2
E1
e
F
A1 A
A1 ball
A1 ball
identifier index area
X
E
A
F
D1
e
H
8
BOTTOM VIEW
1
Y
D
Øb (64 balls)
Ø eee
M
Z Y X
Ø fff
M
Z
TOP VIEW
R8_ME_V3
1. Drawing is not to scale.
Table 57. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
Symbol
Min
A
A1
A2
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
-
0.150
-
-
0.250
4.850
-
4.850
-
-
-
-
-
-
Typ
-
-
0.200
-
0.300
5.000
3.500
5.000
3.500
0.500
0.750
-
-
-
Max
1.200
-
-
0.600
0.350
5.150
-
5.150
-
-
-
0.080
0.150
0.050
Min
-
0.0059
-
-
0.0098
0.1909
-
0.1909
-
-
-
-
-
-
Typ
-
-
0.0079
-
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
-
-
-
Max
0.0472
-
-
0.0236
0.0138
0.2028
-
0.2028
-
-
-
0.0031
0.0059
0.0020
inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
90/105
DocID13587 Rev 16
STMICROELECTRONICS [ STMICROELECTRONICS ]
