STM32F103x8, STM32F103xB
Package characteristics
Figure 45. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
outline
Z Seating plane
ddd Z
A4 A2
E1
e
F
A1 A
A1 ball
A1 ball
identifier index area
X
E
A
F
D1
e
K
10
BOTTOM VIEW
1
Y
D
Øb (100 balls)
Ø eee
M
Z Y X
Ø fff
M
Z
TOP VIEW
H0_ME_V2
1. Drawing is not to scale.
Table 53. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
millimeters
Symbol
A
A1
A2
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
9.850
0.450
9.850
0.500
10.000
7.200
10.000
7.200
0.800
1.400
0.120
0.150
0.080
100
10.150
0.3878
0.270
0.300
0.800
0.550
10.150
0.0177
0.3878
0.0197
0.3937
0.2835
0.3937
0.2835
0.0315
0.0551
0.0047
0.0059
0.0031
0.3996
Min
Typ
Max
1.700
0.0106
0.0118
0.0315
0.0217
0.3996
Min
inches
(1)
Typ
Max
0.0669
DocID13587 Rev 16
85/105
104
STMICROELECTRONICS [ STMICROELECTRONICS ]
