SMA6TY
Characteristics
Figure 10. Junction capacitance versus reverse Figure 11. Junction capacitance versus
applied voltage for unidirectional
types (typical values)
reverse applied voltage for
bidirectional types (typical values)
C(pF)
C(pF)
10000
1000
100
10000
1000
100
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMA6T6V7AY
SMA6T6V7CAY
SMA6T30AY
SMA6T30CAY
SMA6T82AY
SMA6T82CAY
VR(V)
VR(V)
10
10
1
10
100
1000
1
10
100
1000
Figure 12. Relative variation of thermal
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead
impedance, junction to ambient,
versus pulse duration
Rth(j-a)(°C/W)
Zth (j-a)/Rth (j-a)
130
120
110
100
90
1.00
0.10
0.01
Printed circuit board FR4,
printed circuit board FR4,
copper thickness = 35 µm
2
copper surface = 1 cm
80
70
60
50
SCu(cm²)
t
s
p
40
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 14. Leakage current versus junction
temperature (typical values)
Figure 15. Peak forward voltage drop versus
peak forward current
(typical values)
IFM(A)
IR(nA)
1.E+04
1.E+01
VR=VRM
1.E+03
Tj=125 °C
VRM ≤ 10 V
1.E+00
Tj=25 °C
1.E+02
1.E+01
1.E+00
1.E-01
VRM > 10 V
VFM(V)
Tj(°C)
1.E-02
25
50
75
100
125
150
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
Doc ID 17869 Rev 3
7/11
STMICROELECTRONICS [ ST ]
