Package mechanical data
M95640-W M95640-R M95640-DF
Figure 24. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
outline
E
B
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+
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EEE
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1. Drawing is not to scale.
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2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 24. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
millimeters
Min
inches(1)
Symbol
Typ
Max
Typ
Min
Max
A
0.550
0.020
0.250
2.000
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.0217
0.0008
0.0098
0.0787
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
A1
b
D
D2 (rev MC)
E
3.000
0.500
0.1181
0.0197
E2 (rev MC)
e
K (rev MC)
0.300
0.300
0.0118
0.0118
L
L1
0.500
0.150
0.0197
0.0059
L3
0.300
0.080
0.0118
0.0031
eee(2)
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
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Doc ID 16877 Rev 16
STMICROELECTRONICS [ ST ]
