M24C64, M24C32
REVISION HISTORY
Table 23. Document Revision History
Date
22-Dec-1999
28-Jun-2000
31-Oct-2000
Rev.
2.3
2.4
2.5
Description of Revision
TSSOP8 package in place of TSSOP14 (pp 1, 2, OrderingInfo, PackageMechData).
TSSOP8 package data corrected
References to Temperature Range 3 removed from Ordering Information
Voltage range -S added, and range -R removed from text and tables throughout.
Lead Soldering Temperature in the Absolute Maximum Ratings table amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data updated
Test condition for I
LI
made more precise, and value of I
LI
for E2-E0 and WC added
-R voltage range added
Document reformatted using new template.
TSSOP8 (3x3mm² body size) package (MSOP8) added.
5ms write time offered for 5V and 2.5V devices
SO8W package removed. -S voltage range removed
TSSOP8 (3x3mm² body size) package (MSOP8) removed
Table of contents, and Pb-free options added. Minor wording changes in Summary
Description, Power-On Reset, Memory Addressing, Write Operations, Read Operations.
V
IL
(min) improved to -0.45V.
Absolute Maximum Ratings for V
IO
(min) and V
CC
(min) improved. Soldering temperature
information clarified for RoHS compliant devices. Device Grade clarified
Product List summary table added. Device Grade 3 added. 4.5-5.5V range is Not for New
Design. Some minor wording changes. AEC-Q100-002 compliance. t
NS
(max) changed.
V
IL
(min) is the same on all input pins of the device. Z
WCL
changed.
UFDFPN8 package added. Small text changes.
20-Apr-2001
2.6
16-Jan-2002
2.7
02-Aug-2002
04-Feb-2003
27-May-2003
22-Oct-2003
2.8
2.9
2.10
3.0
01-Jun-2004
4.0
04-Nov-2004
05-Jan-2005
5.0
6.0
25/26
STMICROELECTRONICS [ STMICROELECTRONICS ]
