M24C16, M24C08, M24C04, M24C02, M24C01
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
e
b
D
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V . It must not be allowed to be connected to
SS
any other voltage or signal line on the PCB, for example during the soldering process.
Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data
mm
Min.
0.50
0.00
0.20
inches
Min.
Symbol
Typ.
Max.
0.60
0.05
0.30
Typ.
Max.
0.024
0.002
0.012
A
A1
b
0.55
0.022
0.020
0.000
0.008
0.25
2.00
0.010
0.079
D
D2
ddd
E
1.55
1.65
0.05
0.061
0.065
0.002
3.00
0.118
E2
e
0.15
–
0.25
–
0.006
–
0.010
–
0.50
0.45
0.020
0.018
L
0.40
0.50
0.15
0.016
0.020
0.006
L1
L3
N
0.30
0.012
8
8
23/29
STMICROELECTRONICS [ ST ]
