M24C16, M24C08, M24C04, M24C02, M24C01
PART NUMBERING
Table 20. Ordering Information Scheme
Example:
M24C16
–
W DW
3
T
P
/W
Device Type
2
M24 = I C serial access EEPROM
Device Function
16 = 16 Kbit (2048 x 8)
08 = 8 Kbit (1024 x 8)
04 = 4 Kbit (512 x 8)
02 = 2 Kbit (256 x 8)
01 = 1 Kbit (128 x 8)
Operating Voltage
W = V = 2.5 to 5.5V (400 kHz)
CC
R = V = 1.8 to 5.5V (400 kHz)
CC
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
DS = TSSOP8 (3x3mm² body size, MSOP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
1
3 = Device tested with High Reliability Certified Flow .
Automotive temperature range (–40 to 125 °C)
Option
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK® (RoHS compliant)
2
Process
/W or /S = F6SP36%
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-
tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
2. Used only for Device Grade 3.
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Of-
fice.
The category of second Level Interconnect is
marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions
are also marked on the inner box label.
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STMICROELECTRONICS [ ST ]
