LM2904
Package Mechanical Data
4
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
4.1
DIP8 Package
Plastic DIP-8 MECHANICAL DATA
mm.
DIM.
MIN.
A
a1
B
B1
b
b1
D
E
e
e3
e4
F
I
L
Z
0.44
3.3
1.6
0.017
8.8
2.54
7.62
7.62
7.1
4.8
0.130
0.063
0.38
0.7
1.39
0.91
0.5
0.5
9.8
0.346
0.100
0.300
0.300
0.280
0.189
0.015
1.65
1.04
TYP
3.3
0.028
0.055
0.036
0.020
0.020
0.386
0.065
0.041
MAX.
MIN.
TYP.
0.130
MAX.
inch
P001F
11/15
STMICROELECTRONICS [ STMICROELECTRONICS ]
