Package Mechanical Data
LM158-LM258-LM358-LM158A-LM258A-LM358A
5
Package Mechanical Data
®
In order to meet environmental requirements, ST offers these devices in ECOPACK packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com..
5.1
DIP8 Package
Plastic DIP-8 MECHANICAL DATA
mm.
TYP
3.3
inch
TYP.
0.130
DIM.
MIN.
MAX.
MIN.
MAX.
A
a1
B
0.7
1.39
0.91
0.028
0.055
0.036
1.65
1.04
0.065
0.041
B1
b
0.5
0.020
b1
D
E
0.38
0.5
9.8
0.015
0.020
0.386
8.8
0.346
0.100
0.300
0.300
e
2.54
7.62
7.62
e3
e4
F
7.1
4.8
0.280
0.189
I
L
3.3
0.130
Z
0.44
1.6
0.017
0.063
P001F
12/16
STMICROELECTRONICS [ ST ]
