Die information
RHFL7913A
7
Die information
RHFL7913A adjustable is also available in die form. Space dice are electrically tested by
STMicroelectronics in such a way that, when mounted in proper thermal and electrical
substrate, they are in full compliance with equivalent packaged device:
DIE physical dimensions.
DIE size: 110 mils x 166 mils
DIE thickness: 375 µm +/-25 µm (14.8 mils +/- 1 mil)
Pad size:
V , V pads: 245 µm x 544 µm
I
O
Control pads: 184 µm x 184 µm
Interface materials
Top Metallization: Al/Si/Cu 1.05 µm +/- 0.15 µm
Backside metallization: None
Glassivation
Type: P.Vapox + Nitride
Thickness: 0.6 µm +/- 0.1µm + 0.6µm +/-0.08 µm
Substrate: Silicon (connected to V = V
)
minus
I
The SENSE pad is layout on the die but is not electrically connected to the IC and shall be
left non-bonded during hybrid bonding.
Figure 3.
DIE size
12/19
STMICROELECTRONICS [ ST ]
