L6219DSA
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
DIM.
MIN.
A
A1
B
C
D
(1)
E
e
H
h
L
k
ddd
10.0
0.25
0.40
2.35
0.10
0.33
0.23
15.20
7.40
1.27
10.65
0.75
1.27
0.394
0.010
0.016
TYP.
MAX.
2.65
0.30
0.51
0.32
15.60
7.60
MIN.
0.093
0.004
0.013
0.009
0.598
0.291
0.050
0.419
0.030
0.050
TYP.
MAX.
0.104
0.012
0.200
0.013
0.614
0.299
Weight:
0.60gr
SO24 mechanical data and package dimensions
mm
inch
OUTLINE AND
MECHANICAL DATA
0˚ (min.), 8˚ (max.)
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
SO24
0070769 C
13/15
STMICROELECTRONICS [ STMICROELECTRONICS ]
