BAT54 Series
Package information
Table 10. SOT-666 dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
b1
Ref.
Inches
L1
A
0.45
0.60 0.018
0.18 0.003
0.34 0.007
0.024
0.007
0.013
L3
A3 0.08
0.17
b
b
D
E1
E
b1 0.19 0.27 0.34 0.007 0.011 0.013
D
E
1.50
1.50
1.70 0.059
1.70 0.059
1.30 0.043
0.067
0.067
0.051
A
L2
A3
E1 1.10
e
0.50
0.19
0.020
0.007
L1
L2 0.10
L3
0.30 0.004
0.012
e
0.10
0.004
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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