Characteristics
BAT54
Figure 7.
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Epoxy FR4
e
CU
=35 µm
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
Single pulse
SOD323
600
R
th(j-a)
(°C/W)
1.E+00
Z
th(j-a)
/R
th(j-a)
500
1.E-01
400
1.E-02
300
S
CU
(mm²)
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
t
P
(s)
200
0
5
10
15
20
25
30
35
40
45
50
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-23)
Single pulse
SOT23
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-523)
1.E+00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD523
1.E+00
Z
th(j-a)
/R
th(j-a)
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
t
P
(s)
t
P
(s)
Epoxy FR4
e
CU
=35 µm
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration
1.E+00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT666
1.E-01
t
P
(s)
Epoxy FR4
e
CU
=35 µm
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
4/13
Doc ID 5505 Rev 10
STMICROELECTRONICS [ STMICROELECTRONICS ]
