1.5KE
Characteristics
Figure 7.
Capacitance versus reverse applied Figure 8.
voltage for bidirectional types
(typical values)
Peak forward voltage drop versus
peak forward current (typical values
for unidirectional types)
10000
IFM (A)
500
Multiply by 2 for units with V
BR
> 220 V
F
100
1000
100
10
VFM (V)
10
1
10
100
500
1
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Figure 9.
Transient thermal impedance
junction-ambient versus pulse
duration
Figure 10. Relative variation of leakage
current versus junction
temperature
100
Zth (j-a) (°C/W)
Epoxy printed circuit board, FR4
copper thickness = 35 µm
10
1
tp (s)
0.1
0.01
0.1
1
10
100
1000
Doc ID 2913 Rev 4
5/10
STMICROELECTRONICS [ STMICROELECTRONICS ]
