QFN
Quad Flat No-Lead Package
• Punch or Saw singulated formats
• Body sizes from 2 x 2mm to 12 x 12mm
• Pin counts from 4L to 156L
• Square or rectangular body sizes
• Leads on four sides of the body (QFN)
• Leads on two opposing sides of the
body (DFN)
• Dual row lead design options
• Thin package thickness options
FEATURES
• Body sizes: 2 x 2 to 12 x 12mm
• Lead pitch: 0.40, 0.50, 0.65 and 0.80mm
• Custom lead/pitch configurations available
• Package profile heights: 0.45, 0.50, 0.75, 0.85 and
0.90mm
• Option for non-exposed die pad
• Green materials set
• Option for PbSn, 100% matte Sn or PPF
• Small chip scale design offers 50% reduction in board
space (16L TSSOP vs. 16L QFN)
• 33% weight reduction (in 16L TSSOP vs. 16L QFN)
• Excellent thermal & electrical performance
• Full in-house package and leadframe design capability
• Full in-house assembly and test capability
• Full in-house electrical, thermal and mechanical
simulation and measurement capability
• Wide range of open tool leadframe and die pad sizes
available
• JEDEC standard compliant (XQFN, UQFN, WQFN, VQFN)
DESCRIPTION
STATS ChipPAC’s Quad Flat No-Lead (QFN) and Dual Flat
No-Lead (DFN) package offering includes the QFNs (saw
singulated), QFNp (punch singulated), XQFN, UQFN, WQFN,
and QFN-dr. These are leadframe based, plastic encapsulated,
chip scale packages in single mold cavity format (punch
singulated) or molded array format (saw singulated).
An exposed die pad coupled with extremely low RLC
provides excellent electrical and thermal performance
enhancements which are ideal for high frequency and high
power applications, and are especially suited for wireless
and handheld portable applications such as cell phones.
QFN-dr with staggered dual row leads offers higher I/O
counts. STATS ChipPAC’s QFN packages are currently
available in various body sizes and thicknesses, offered in
standard and green/lead-free bill of materials and can be
processed by conventional SMT equipment, benefiting
surface mount operations downstream.
APPLICATIONS
• RF
• Power management
• Discretes
• Analog/Linear
• Logic
• Applications requiring enhanced electrical and thermal
performance and reduced package size, thickness and
weight
www.statschippac.com
STATSCHIP [ STATS CHIPPAC, LTD. ]
