LQFP
Low Profile Quad Flat Pack
SPECIFICATIONS
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
280-430µm (11-17mils) range preferred
25/30µm (1.0/1.2mils) diameter, 99.999%Au
85/15 Sn/Pb or Matte Tin
Laser / ink
JEDEC tray / tape and reel
Liquid Thermal Shock (opt)
RELIABILITY
Moisture Sensitivity Level
Temperature Cycling
High Temperature Storage
Pressure Cooker Test
JEDEC Level 3
-65°C/150°C, 1000 cycles
150°C, 500 hrs
121°C 100% RH,
2 atm, 168 hrs
-55°C/125°C, 1000 cycles
THERMAL PERFORMANCE,
θ
ja (°C/W)
Package
48L
100L
208L
Body Size (mm)
7 x 7 x 1.4
14 x 14 x 1.4
28 x 28 x 1.4
Pad Size (mm)
5.3 x 5.3
9.0 x 9.0
9.0 x 9.0
Die Size (mm)
3.8 x 3.8
7.8 x 7.8
7.8 x 7.8
Thermal Performance,
θ
ja (°C/W)
50.0
37.2
32.1
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Component
Wire
Lead (7 x 7mm, 32L)
Total (7 x 7mm, 32L)
Wire
Lead (14 x 14mm, 128L)
Total (14 x 14mm, 128L)
2
3.0 - 4.5
Length
(mm)
2
1.4 - 2.2
Resistance
(mOhms)
120
11.0 - 18.0
131 - 138
120
24.0 - 36.0
144.0 - 156.0
Inductance
(nH)
1.65
0.64 - 0.99
2.29 - 2.64
1.65
1.96 - 2.92
3.61 - 4.57
Inductance
Mutual (nH)
0.45 - 0.85
0.31 - 0.49
0.76 - 1.34
0.45 - 0.85
1.08 - 1.61
1.53 - 2.46
Capacitance
(pF)
0.10
0.21 - 0.33
0.31 - 0.43
0.10
0.45 - 0.67
0.55 - 0.77
Capacitance
Mutual (pF)
0.01 - 0.02
0.07 - 0.12
0.08 - 0.14
0.01 - 0.02
0.20 - 0.30
0.21 - 0.32
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package Size (mm)
7x7
10 x 10
12 x 12
14
14
20
24
x
x
x
x
14
20
20
24
Lead Count
32, 40, 48
44, 64
80, 100
44, 64, 80, 100, 128
128
144,184
176
208
28 x 28
Corporate Office
Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
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NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
STATSCHIP [ STATS CHIPPAC, LTD. ]
