SPECIFICATIONS
Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice.
Fundamental Frequency
Motional Resistance R1 (
14.7456 MHz 16MHz
20 MHz
50
32 MHz
30
40 MHz
30
Ω)
60
1.4
120
0.8
75
1.5
90
Motional Capacitance C1 (fF)
Quality Factor Q (k)
1.4
2.5
1.5
110
0.9
70
90
Shunt Capacitance C0 (pF)
0.9
1.1
1.0
Frequency Range1
Calibration Tolerance2
Load Capacitance
14 MHz to 50 MHz
+_ 100 ppm, or tighter as required
TERMINATIONS
Designation Termination
10 pF (unless specified otherwise)
SM1
SM2
SM3
SM4
SM5
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Drive Level
200 µW MAX
+
+
_
Frequency-Temperature
Stability2,3
_ 50 ppm to 10 ppm (Commercial)
+
+
_
_ 100 ppm to 20 ppm (Industrial)
+
+
_
_ 100 ppm to 30 ppm (Military)
Aging, first year4
10 ppm MAX
Max Process Temperature 260OC for 20 sec
Shock, survival
Vibration, survival5
Up to 100,000 g, 0.5 ms, 1/2 sine
20 g, 10-2,000 Hz swept sine
-10OC to +70OC (Commercial)
EQUIVALENT CIRCUIT
C0
Operating Temp. Range
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
-55OC to +125OC
1
L1
C1
R1
2
Storage Temp. Range
Max Process Temperature 260OC for 20 sec
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
1. Other frequencies available. Contact factory.
2. Other tolerances available. Contact factory.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
SUGGESTED LAND PATTERN
4. Lower aging available at low shock levels.
5. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
0.059 (1.5)
PACKAGING OPTIONS
0.092 (2.3)
• Tray Pack
• Tape and Reel
Per EIA 481 (see Tape and Reel data sheet 10109)
0.160 (4.0)
inches (mm)
HOW TO ORDER CX4HGSM AT CRYSTALS
CX4
S
HG1
C
SM1 – 32.0M
,
100
/
100
/
—
/
I
Frequency Calibration
Frequency
Stability over
Temp. Range
Operating Temp. Range:
C
“S” if special or
custom design.
Blank if standard
Shock Level
C = Ceramic Lid
Blank = Glass Lid
= -10OC to +70OC
= -40OC to +85OC
M = MHz
Tolerance
@25OC
HG1 = 10,000 g
HG2 = 20,000 g
HG3 = 30,000 g
HG4 = 50,000 g
HG5 = 75,000 g
HG6 = 100,000 g
I
M = -55OC to +125OC
(in ppm)
Termination
SM1 = Gold Plated
S
= Customer Specified
OR
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated
(Lead Free)
—
/
—
/
200
/
I
SM5 = Solder Dipped
(Lead Free)
Total
Operating Temp. Range:
C
= -10OC to +70OC
= -40OC to +85OC
Frequency
Tolerance
(in ppm)
I
M = -55OC to +125OC
S
= Customer Specified
10165 Rev B
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
STATEK [ STATEK CORPORATION ]
