SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Designation Termination
SM1
SM2
SM3
SM4
SM5
Gold Plated
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Fundamental Frequency
Motional Resistance R1 (
10 MHz 32 MHz 155.52 MHz
Ω)
60
25
10
Motional Capacitance C1 (fF)
2.8
6.2
4.0
Quality Factor Q (k)
95
30
30
Shunt Capacitance C0 (pF)
1.4
2.3
2.3
Max Process Temperature 260OC for 20 sec.
Calibration Tolerances1
Load Capacitance2
100 ppm, or tighter as required
20 pF for f ≤ 50 MHz
SUGGESTED LAND PATTERN
0.070 (1.78)
10 pF for f > 50 MHz
Drive Level
500
200
µ
µ
W MAX for f ≤ 50 MHz
W MAX for f > 50 MHz
0.120 (3.05)
Frequency-Temperature
Stability1,3
50 ppm to 10 ppm (Commercial)
100 ppm to 20 ppm (Industrial)
100 ppm to 30 ppm (Military)
10 ppm MAX
Aging, first year4
0.215 (5.46)
inches (mm)
Shock, survival
Up to 20,000 g, 0.3 ms, 1/2 sine
20 g, 10-2,000 Hz swept sine
Vibration, survival5
EQUIVALENT CIRCUIT
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
C0
L1
C1
R1
Storage Temp. Range
-55OC to +125OC
Max Process Temperature 260OC for 20 sec.
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature
follow that of the AT thickness-shear mode.
4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact
factory.
PACKAGING OPTIONS
5. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
• Tray Pack
• 16mm tape, 7” or 13” reels
Per EIA 481 (see Tape and Reel data sheet 10109)
HOW TO ORDER CX3HGSM AT CRYSTALS
CX3
S
HG1
C
SM1
–
32.0M
,
100
/
100
/
—
/
I
“S” if special or
custom design.
Blank if Std.
HG1 = 10,000 g
HG2 = 20,000 g
Calibration
Tolerance
@ 25OC
Operating Temp. Range:
C = Ceramic Lid
Blank = Glass Lid
Frequency
M = MHz
Frequency
Stability over
Temp. Range
(in ppm)
C
= -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
(in ppm)
SM1 = Gold Plated
SM2 = Solder Plated
SM3 = Solder Dipped
S
= Customer Specified
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
OR
—
/
—
/
200
Total
Frequency
Tolerance
(in ppm)
/
I
Operating Temp. Range:
C
= -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S
= Customer Specified
10182 Rev A
E
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com