PS3022
Through-hole Phototransistor/φ5 Type
TTW (Through The Wave) soldering Conditions
Pre-heating
100 ℃
(MAX.) Resin surface temperature
Solder Bath Temp.
Dipping Time
Position
(MAX.)
(MAX.)
265 ℃
5 s
At least 3.0 mm away from the root of lead
1) The dip soldering process shall be twice maximum.
2) The product shall be cooled to normal temperature before the second dipping process.
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
Manual Soldering Conditions
Iron tip temp.
(MAX.) (30 W Max.)
(MAX.)
400 ℃
3 s
Soldering time and frequency
1 time (MAX.)
Position
At least 3.0 mm away from the root of lead
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
Page 8
2007.8.31
STANLEY [ STANLEY ELECTRIC CO.,LTD. ]
