141S/143S Series
Numeric Display/Case Size 9.6 x 13.0 mm
TTW (Through The Wave) soldering Conditions
100 ℃
60 s
(MAX.) Resin surface temperature
(MAX.)
Pre-heating
Solder Bath Temp.
Dipping Time
Position
(MAX.)
(MAX.)
265 ℃
5 s
At least 2.0 mm away from the root of lead
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to normal temperature before the second dipping process.
Manual Soldering Conditions
Iron tip temp.
(MAX.)
(MAX.)
360 ℃
3 s
Soldering time and frequency
2 times (MAX.)
Position
At least 2.0 mm away from the root of lead
Page 10
2012.11.19