3373K Series
Single Color Semi-Round Shape Type
TTW (Through The Wave) soldering Conditions
100 ℃
(MAX.)
Pre-heating
Solder Bath Temp.
Dipping Time
(MAX.)
(MAX.)
265℃
5 s
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to room temp. before the second dipping process.
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
(MAX.)
(MAX.)
400℃
3 s
2 times (MAX.)
※The detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
Page 31
2006.3.31
STANLEY [ STANLEY ELECTRIC CO.,LTD. ]
