8 Mbit / 16 Mbit Multi-Purpose Flash
SST39LF080 / SST39LF016 / SST39VF080 / SST39VF016
Data Sheet
PACKAGING DIAGRAMS
1.05
0.95
Pin # 1 Identifier
.50
BSC
.270
.170
10.10
9.90
0.15
0.05
18.50
18.30
0.70
0.50
20.20
19.80
Note:
1. Complies with JEDEC publication 95 MO-142 CD dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
40.TSOP-EI-ILL.4
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
40-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 10MM X 20MM
SST PACKAGE CODE: EI
©2001 Silicon Storage Technology, Inc.
S71146-03-000 6/01 396
25
SST [ SILICON STORAGE TECHNOLOGY, INC ]
