2 Mbit / 4 Mbit / 8 Mbit Multi-Purpose Flash
SST39LF200A / SST39LF400A / SST39LF800A
SST39VF200A / SST39VF400A / SST39VF800A
Data Sheet
PACKAGING DIAGRAMS
1.05
0.95
Pin # 1 Identifier
.50
BSC
.270
.170
12.20
11.80
0.15
0.05
18.50
18.30
0.70
0.50
48-TSOP-EK-ILL.6
20.20
19.80
Note:
1. Complies with JEDEC publication 95 MO-142 DD dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max). Scale is 1:5 mm.
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
48-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 12MM X 20MM
SST PACKAGE CODE: EK
©2001 Silicon Storage Technology, Inc.
S71117-04-000 6/01 360
28
SST [ SILICON STORAGE TECHNOLOGY, INC ]
