4 Mbit SuperFlash EEPROM
SST28SF040A / SST28VF040A
Data Sheet
PACKAGING DIAGRAMS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
.485
.495
.447
.106
.112
Optional
.453
Pin #1 Identifier
.042
.023
.029
.030
.040
.020 R.
MAX.
x 30˚
R.
.048
2
1
32
.042
.048
.013
.021
.400 .490
BSC .530
.585
.595
.547
.553
.026
.032
.050
BSC.
.015 Min.
.075
.095
.050
BSC.
.026
.032
.125
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32.PLCC.NH-ILL.2
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
1.05
0.95
Pin # 1 Identifier
.50
BSC
.270
.170
8.10
7.90
0.15
0.05
12.50
12.30
0.70
0.50
14.20
13.80
32.TSOP-WH-ILL.4
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
©2001 Silicon Storage Technology, Inc.
S71077-04-000 6/01 310
23
SST [ SILICON STORAGE TECHNOLOGY, INC ]
