2.4 GHz Power Amplifier
SST12LP14
Preliminary Specifications
PACKAGING DIAGRAMS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
See notes
2 and 3
0.2
Pin #1
Pin #1
1.7
3.00 ± 0.10
1.7
0.5 BSC
0.076
0.05 Max
0.45
0.35
3.00 ± 0.10
1.00
0.80
0.30
0.18
1mm
16-vqfn-3x3-QVC-0.0
Note: 1. Complies with JEDEC JEP95 MO-220I, variant VEED except external paddle nominal dimensions.
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain V leads.
SS
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the V of the unit.
SS
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
16-CONTACT VERY-THIN QUAD FLAT NO-LEAD (VQFN)
SST PACKAGE CODE: QVC
TABLE 4: REVISION HISTORY
Revision
Description
Date
00
Jan 2005
•
S71279: SST conversion of data sheet GP1214
©2005 SST Communications Corp.
S71279-00-000
1/05
11
SST [ SILICON STORAGE TECHNOLOGY, INC ]
