FlashFlex51 MCU
SST89E52RD2 / SST89E54RD2 / SST89E58RD2 / SST89E516RD2
SST89V52RD2 / SST89V54RD2 / SST89V58RD2 / SST89V516RD2
Preliminary Specifications
44
34
Pin #1 Identifier
1
33
.30
.45
10.00 ± 0.10
.80 BSC
12.00 ± 0.25
11
23
.09
.20
12
22
10.00 ± 0.10
12.00 ± 0.25
.95
1.05
1.2
max.
0˚- 7˚
.45
.75
.05
.15
1.00 ref
Note:
1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
44-tqfp-TQJ-7
3. Coplanarity: 0.1 (±0.05) mm.
4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.
1mm
44-LEAD THIN QUAD FLAT PACK (TQFP)
SST PACKAGE CODE: TQJ
TABLE 16-1: REVISION HISTORY
Number
Description
Date
00
Mar 2004
•
Initial Release
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2004 Silicon Storage Technology, Inc.
S71255-00-000
3/04
91
SST [ SILICON STORAGE TECHNOLOGY, INC ]
