SS12 thru SS115
RATINGS AND CHARACTERISTIC CURVES
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
1.0
50
RESISTIVE OR
INDUCTIVE LOAD
SS12- SS14
SS15-SS115
0.5
FIG.2- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT. (A)
AVERAGE FORWARD CURRENT. (A)
40
AT RATED TL
8.3ms Single Half Sine Wave
JEDEC Method
30
20
10
PCB MOUNTED ON 0.2X0.2"
(5.0X5.0mm) COPPER PAD AREAS
0
50
60
70
80
90
100
110
120
130
o
0
140
150
160
170
1
LEAD TEMPERATURE. ( C)
10
NUMBER OF CYCLES AT 60Hz
100
FIG.3- TYPICAL FORWARD CHARACTERISTICS
100
50
FIG.4- TYPICAL REVERSE CHARACTERISTICS
SS12-SS14
SS15-SS115
INSTANTANEOUS REVERSE CURRENT. (mA)
SS19-SS110
10
SS15-SS16
INSTANTANEOUS FORWARD CURRENT. (A)
10
SS12-SS14
Tj=125
0
C
1
1
SS115
0.1
Tj=75
0
C
0.1
0.01
Tj=25 C
O
PULSE WIDTH=300 S
1% DUTY CYCLE
0.01
0
.2
.4
.6
.8
1.0
1.2
1.4
1.6
FORWARD VOLTAGE. (V)
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
FIG.5- TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANCE. (
O
C/W)
400
Tj=25
0
C
f=1.0MHz
Vsig=50mVp-p
FIG.6- TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
100
JUNCTION CAPACITANCE.(pF)
100
SS12-SS14
SS15-SS16
SS19-SS115
10
1
10
0.1
1.0
10
100
0.1
0.01
0.1
1
10
T, PULSE DURATION. (sec)
100
REVERSE VOLTAGE. (V)
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Silicon Standard Corporation or any third parties.
12/12/2007 Rev.1.00
www.SiliconStandard.com
3
SSC [ SILICON STANDARD CORP. ]
