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SL2309NZ 参数 Datasheet PDF下载

SL2309NZ图片预览
型号: SL2309NZ
PDF下载: 下载PDF文件 查看货源
内容描述: 低抖动和偏斜DC至140 MHz的时钟缓冲器 [Low Jitter and Skew DC to 140 MHz Clock Buffer]
分类和应用: 时钟
文件页数/大小: 8 页 / 119 K
品牌: SPECTRALINEAR [ SPECTRALINEAR INC ]
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SL2309NZ  
General Description  
Output Clock Skew  
The SL2309NZ is a low skew, jitter and power fanout  
buffer designed to produce up to nine (9) clock outputs  
from one (1) reference input clock, for high speed clock  
distribution, including PCI/PCI-X applications.  
All outputs should drive the similar load to achieve output-  
to-output skew specifications as given in the switching  
electrical tables.  
Power Supply Range (VDD)  
Input and output Frequency Range  
The SL2309NZ is designed to operate 3.3V+/-10% (3.63V-  
max to 2.97V-min) VDD power supply range. An internal  
on-chip voltage regulator is used to provide to constant  
power supply of 1.8V, leading to a consistent and stable  
electrical performance in terms of skew and jitter. The  
SL2309NZ I/O is powered by using VDD=3.3V+/-10%.  
The input and output frequency is the same (1x) for  
SL2309NZ and the product operates from DC to  
140MHz clock range with 15pF and 100MHz with 30pF  
output loads.  
High Drive Capability  
Refer to SL23EP09NZ products for DC to 220MHz-max  
frequency range, 2.5V power supply operation, improved  
skew, jitter and higher drive options.  
The SL2309NZ is designed to meet high drive  
requirements for up to 30pF load condition per electrical  
specifications.  
Contact SLI for 1.8V power supply Buffers and ZDB  
products.  
If higher drive levels are required refer to SL23EP09NZ  
fanout buffer product.  
Absolute Maximum Ratings (C-Grade and I-Grade)  
Description  
Supply voltage, VDD  
Condition  
Min  
-0.5  
-0.5  
0
Max  
4.6  
Unit  
V
All Inputs and Outputs  
VDD+0.5  
70  
V
Ambient Operating Temperature  
Ambient Operating Temperature  
Storage Temperature  
In operation, C-Grade  
°C  
°C  
°C  
°C  
°C  
V
In operation, I-Grade  
-40  
-65  
85  
No power is applied  
150  
125  
260  
Junction Temperature  
In operation, power is applied  
Soldering Temperature  
ESD Rating (Human Body Model)  
MIL-STD-883, Method 3015  
2000  
Rev 1.2, April 28, 2007  
Page 3 of 8  
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