SL23EP09NZ
Package Outline and Package Dimensions
16-Lead SOIC (150 Mil)
16
9
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
0.150(3.810)
0.157(3.987
Pin-1 ID
0.230(5.842)
0.244(6.197)
1
8
0.189(4.800)
0.196(4.978)
0.010(0.2540)
0.016(0.406)
X 45°
0.0075(0.190)
0.0098(0.249)
0.061(1.549)
0.068(1.727)
0.004(0.102)
Seating plane
0.050(1.270)
BSC
0.016(0.406)
0.035(0.889)
0° to 8°
0.004(0.102)
0.0098(0.249)
0.0138(0.350)
0.0192(0.487)
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
120
115
105
Max
Unit
ș JA
ș JA
ș JA
Still air
-
-
-
-
-
-
°C/W
°C/W
°C/W
Thermal Resistance
Junction to Ambient
1m/s air flow
3m/s air flow
Thermal Resistance
Junction to Case
ș JC
Independent of air flow
-
60
-
°C/W
Rev 1.1, May 18, 2007
Page 10 of 11
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