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S71GL064A80BAI0F3 参数 Datasheet PDF下载

S71GL064A80BAI0F3图片预览
型号: S71GL064A80BAI0F3
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP )闪存和RAM [Stacked Multi-Chip Product (MCP) Flash Memory and RAM]
分类和应用: 闪存
文件页数/大小: 102 页 / 1762 K
品牌: SPANSION [ SPANSION ]
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A d v a n c e I n f o r m a t i o n  
Write Buffer  
Write Buffer Programming allows the system write to a maximum of 16 in one  
programming operation. This results in faster effective programming time than  
the standard programming algorithms. See “Write Buffer” for more information.  
Accelerated Program Operation  
The device offers accelerated program operations through the ACC function. This  
is one of two functions provided by the WP#/ACC or ACC pin, depending on model  
number. This function is primarily intended to allow faster manufacturing  
throughput at the factory.  
If the system asserts VHH on this pin, the device automatically enters the afore-  
mentioned Unlock Bypass mode, temporarily unprotects any protected sector  
groups, and uses the higher voltage on the pin to reduce the time required for  
program operations. The system would use a two-cycle program command se-  
quence as required by the Unlock Bypass mode. Removing VHH from the WP#/  
ACC or ACC pin, depending on model number, returns the device to normal op-  
eration. Note that the WP#/ACC or ACC pin must not be at VHH for operations  
other than accelerated programming, or device damage may result. WP# has an  
internal pullup; when unconnected, WP# is at VIH  
.
Autoselect Functions  
If the system writes the autoselect command sequence, the device enters the au-  
toselect mode. The system can then read autoselect codes from the internal  
register (which is separate from the memory array) on DQ7–DQ0. Standard read  
cycle timings apply in this mode. Refer to the “Autoselect Mode” section on page  
31 and “Autoselect Command Sequence” section on page 45 sections for more  
information.  
Standby Mode  
When the system is not reading or writing to the device, it can place the device  
in the standby mode. In this mode, current consumption is greatly reduced, and  
the outputs are placed in the high impedance state, independent of the OE#  
input.  
The device enters the CMOS standby mode when the CE# and RESET# pins are  
both held at VIO ± 0.3 V. (Note that this is a more restricted voltage range than  
VIH.) If CE# and RESET# are held at VIH, but not within VIO ± 0.3 V, the device  
will be in the standby mode, but the standby current will be greater. The device  
requires standard access time (tCE) for read access when the device is in either  
of these standby modes, before it is ready to read data.  
If the device is deselected during erasure or programming, the device draws ac-  
tive current until the operation is completed.  
Refer to the “DC Characteristics” section on page 65 for the standby current  
specification.  
Automatic Sleep Mode  
The automatic sleep mode minimizes Flash device energy consumption. The de-  
vice automatically enables this mode when addresses remain stable for tACC  
+
30 ns. The automatic sleep mode is independent of the CE#, WE#, and OE# con-  
trol signals. Standard address access timings provide new data when addresses  
are changed. While in sleep mode, output data is latched and always available to  
March 31, 2005 S71GL032A_00_A0  
S71GL032A Based MCPs  
23  
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