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S29GL064M90FFIR10 参数 Datasheet PDF下载

S29GL064M90FFIR10图片预览
型号: S29GL064M90FFIR10
PDF下载: 下载PDF文件 查看货源
内容描述: 3.0伏只页面模式闪存具有0.23微米的MirrorBit制程技术 [3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology]
分类和应用: 闪存存储内存集成电路
文件页数/大小: 160 页 / 4686 K
品牌: SPANSION [ SPANSION ]
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P r e l i m i n a r y  
Ordering Information-S29GL032M  
S29GL032M Standard Products  
Standard products are available in several packages and operating ranges. The  
order number (Valid Combination) is formed by a combination of the following:  
S29GL032M  
10  
T
A
I
R1  
2
PACKAGE TYPE  
0
2
3
=
=
=
Tray  
7” Tape and Reel  
13” Tape and Reel  
MODEL NUMBER  
R0  
R1  
=
=
x8, VCC=3.0-3.6V, Uniform sector device  
x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address sector  
protected when WP#/ACC=VIL  
R2  
R3  
R4  
R5  
R6  
=
=
=
=
=
x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector  
protected when WP#/ACC=VIL  
x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors  
protected when WP#/ACC=VIL  
x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two  
address sectors protected when WP#/ACC=VIL  
x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors  
protected when WP#/ACC=VIL, BGA-48P-M20 package only  
x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two  
address sectors protected when WP#/ACC=VIL BGA-48P-M20 package  
only  
TEMPERATURE RANGE  
I
=
Industrial (–40  
°
C to +85 C)  
°
PACKAGE MATERIAL SET  
A
F
B
C
=
=
=
=
Standard  
Pb-Free  
Standard  
Pb-Free  
PACKAGE TYPE  
T
B
F
=
=
=
Thin Small Outline Package (TSOP) Standard Pinout  
Fine-pitch Ball-Grid Array Package  
Fortified Ball-Grid Array Package  
SPEED OPTION  
See Product Selector Guide and Valid Combinations  
DEVICE NUMBER/DESCRIPTION  
S29GL032M  
32 Megabit Page-Mode Flash Memory Manufactured using 0.23 um MirrorBitTM  
Process Technology, 3.0 Volt-only Read, Program, and Erase  
22  
S29GLxxxM MirrorBitTM Flash Family  
S29GLxxxM_00A5 April 30, 2004  
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