P r e l i m i n a r y
Physical Dimensions
LAC064—64-Pin 18 x 12 mm package
D1
D
A
0.20
2X
C
eD
H
G
F
E
D
C
B
A
8
7
6
5
4
3
2
1
7
SE
eE
E
E1
0.50
10.5
A1 CORNER ID.
(INK OR LASER)
A1
CORNER
1.00 0.5
B
6
SD
0.20
2X
C
NXφb
φ 0.25 M C A
7
TOP VIEW
B
A1
φ 0.10 M
C
CORNER
BOTTOM VIEW
0.25
C
A
A2
A1
SEATING PLANE
C
0.15
C
SIDE VIEW
NOTES:
PACKAGE
JEDEC
LAC 064
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
18.00 mm x 12.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
NOM
---
MAX
NOTE
PROFILE HEIGHT
STANDOFF
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
---
1.40
---
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.40
0.60
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
A2
---
---
BODY THICKNESS
BODY SIZE
D
18.00 BSC.
12.00 BSC.
7.00 BSC.
7.00 BSC.
8
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MATRIX FOOTPRINT
MATRIX FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
MD
ME
N
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
8
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
64
φb
0.50
0.60
0.70
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
eD
eE
1.00 BSC.
1.00 BSC.
0.50 BSC.
NONE
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
8. NOT USED.
SD / SE
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
DEPOPULATED SOLDER BALLS
3243 \ 16-038.12d
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBitTM Flash Family
151
SPANSION [ SPANSION ]
