D a t a S h e e t
Connection Diagrams
RY/BY#
1
2
3
4
5
6
7
8
9
44 RESET#
43 WE#
42 A8
A18
A17
A7
A6
A5
A4
A3
A2
A1 10
A0 11
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE#
SO
CE# 12
V
13
32 V
31 DQ15/A-1
30 DQ7
29 DQ14
28 DQ6
27 DQ13
26 DQ5
25 DQ12
24 DQ4
23 V
SS
SS
OE# 14
DQ0 15
DQ8 16
DQ1 17
DQ9 18
DQ2 19
DQ10 20
DQ3 21
DQ11 22
CC
FBGA
Top View, Balls Facing Down
A6
B6
C6
D6
E6
F6
G6
H6
A13
A12
A14
A15
A16
BYTE# DQ15/A-1
V
SS
A5
A9
B5
A8
C5
D5
E5
F5
G5
H5
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
NC
D4
NC
E4
F4
G4
H4
WE#
RESET#
DQ5
DQ12
V
DQ4
CC
A3
B3
NC
C3
D3
NC
E3
F3
G3
H3
RY/BY#
A18
DQ2
DQ10
DQ11
DQ3
A2
A7
B2
C2
A6
D2
A5
E2
F2
G2
H2
A17
DQ0
DQ8
DQ9
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
G1
H1
CE#
OE#
V
SS
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.Flash
memory devices in FBGA packages may be damaged if exposed to ultrasonic
cleaning methods. The package and/or data integrity may be compromised if the
package body is exposed to temperatures above 150°C for prolonged periods of
time.
8
S29AL008D
S29AL008D_00A3 June 16, 2005
SPANSION [ SPANSION ]
