MBM29DL32XTE/BE80/90
(Continued)
Part No.
Package
Access Time (ns)
Remarks
MBM29DL322BE80PBT
MBM29DL322BE90PBT
80
90
63-ball plastic FBGA
(BGA-63P-M01)
MBM29DL323BE80PBT
MBM29DL323BE90PBT
80
90
63-ball plastic FBGA
(BGA-63P-M01)
Bottom Sector
63-ball plastic FBGA
(BGA-63P-M01)
MBM29DL324BE90PBT
90
MBM29DL32X
T
E
80
TN
PACKAGE TYPE
TN = 48-Pin Thin Small Outline Package
(TSOP (1) ) Normal Bend
TR = 48-Pin Thin Small Outline Package
(TSOP (1) ) Reverse Bend
PBT = Fine pitch Ball Grid Array
Package (FBGA)
SPEED OPTION
See Product Selector Guide
DEVICE REVISION
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
MBM29DL32X
32 Mega-bit (4 M × 8-Bit or 2 M × 16-Bit) CMOS Dual Operation Flash Memory
3.0 V-only Read, Program, and Erase
80
SPANSION [ SPANSION ]
