CONNECTION DIAGRAMS
48-Ball Fine-pitch BGA (6 x 12 mm)
Top View, Balls Facing Down
C7
D7
E7
F7
G7
H7
J7
K7
VSS
A13
A12
A14
A15
A16
BYTE# DQ15/A-1
C6
A9
D6
A8
E6
F6
G6
H6
J6
K6
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
VCC
WE# RESET#
NC
A19
DQ5
DQ12
DQ4
C4 D4
E4
F4
G4
H4
J4
K4
RY/BY# WP#/ACC A18
A20
DQ2
DQ10
DQ11
DQ3
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A17
DQ0
DQ8
DQ9
DQ1
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
VSS
CE#
OE#
64-Ball Fortified BGA (11 x 13 mm)
Top View, Balls Facing Down
A8
B8
C8
D8
E8
F8
G8
H8
RFU
RFU
RFU
VIO
VSS
RFU
RFU
RFU
A7
B7
C7
D7
E7
F7
G7
H7
A13
A12
A14
A15
A16
BYTE#
DQ15
VSS
A6
A9
B6
A8
C6
D6
E6
F6
G6
H6
DQ6
A10
A11
DQ7
DQ14
DQ13
A5
B5
C5
D5
E5
F5
G5
H5
WE# RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
A4 B4
C4
D4
E4
F4
G4
H4
RY/BY# WP#/ACC A18
A20
DQ2
DQ10
DQ11
DQ3
A3
A7
B3
C3
A6
D3
A5
E3
F3
G3
H3
A17
DQ0
DQ8
DQ9
DQ1
A2
A3
B2
A4
C2
A2
D2
A1
E2
A0
F2
G2
H2
CE#
OE#
VSS
A1
B1
C1
D1
E1
F1
G1
H1
RFU
RFU
RFU
RFU
RFU
VIO
RFU
RFU
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, SSOP, PLCC,
PDIP). The package and/or data integrity may be
6
Am29DL320G
September 27, 2004
SPANSION [ SPANSION ]
