CONNECTION DIAGRAMS
48-Ball Fine-pitch BGA (6 x 12 mm)
Top View, Balls Facing Down
C7
A13
C6
A9
C5
WE#
C4
D7
A12
D6
A8
D5
RESET#
D4
E7
A14
E6
A10
E5
NC
E4
A18
E3
A6
E2
A2
F7
A15
F6
A11
F5
A19
F4
A20
F3
A5
F2
A1
G7
A16
G6
DQ7
G5
DQ5
G4
DQ2
G3
DQ0
G2
A0
H7
J7
K7
V
SS
K6
DQ6
K5
DQ4
K4
DQ3
K3
DQ1
K2
V
SS
BYTE# DQ15/A-1
H6
DQ14
H5
DQ12
H4
DQ10
H3
DQ8
H2
CE#
J6
DQ13
J5
V
CC
J4
DQ11
J3
DQ9
J2
OE#
RY/BY# WP#/ACC
C3
A7
C2
A3
D3
A17
D2
A4
64-Ball Fortified BGA (11 x 13 mm)
Top View, Balls Facing Down
A8
RFU
A7
A13
A6
A9
A5
WE#
A4
B8
RFU
B7
A12
B6
A8
B5
RESET#
B4
C8
RFU
C7
A14
C6
A10
C5
A21
C4
A18
C3
A6
C2
A2
C1
RFU
D8
V
IO
D7
A15
D6
A11
D5
A19
D4
A20
D3
A5
D2
A1
D1
RFU
E8
V
SS
E7
A16
E6
DQ7
E5
DQ5
E4
DQ2
E3
DQ0
E2
A0
E1
RFU
F8
RFU
F7
BYTE#
F6
DQ14
F5
DQ12
F4
DQ10
F3
DQ8
F2
CE#
F1
V
IO
G8
RFU
G7
DQ15
G6
DQ13
G5
V
CC
G4
DQ11
G3
DQ9
G2
OE#
G1
RFU
H8
RFU
H7
V
SS
H6
DQ6
H5
DQ4
H4
DQ3
H3
DQ1
H2
V
SS
H1
RFU
RY/BY# WP#/ACC
A3
A7
A2
A3
A1
RFU
B3
A17
B2
A4
B1
RFU
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, SSOP, PLCC,
PDIP). The package and/or data integrity may be
compromised if the package body is exposed to
temperatures above 150
°
C for prolonged periods of
time.
6
Am29DL320G
September 27, 2004
SPANSION [ SPANSION ]
