D A T A S H E E T
48-Ball Very Thin Profile Fine-pitch BGA
Top View, Balls Facing Down
A6
B6
C6
D6
E6
F6
G6
H6
VSS
A13
A12
A14
A15
A16
BYTE# DQ15/A-1
A5
A9
B5
A8
C5
D5
E5
F5
G5
H5
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE# RESET#
NC
A19
DQ5
DQ12
VCC
DQ4
A3 B3
C3
D3
E3
F3
G3
H3
RY/BY# WP#/ACC A18
NC
DQ2
DQ10
DQ11
DQ3
A2
A7
B2
C2
A6
D2
A5
E2
F2
G2
H2
A17
DQ0
DQ8
DQ9
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
G1
H1
VSS
CE#
OE#
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (BGA, TSOP, SO, PLCC,
PDIP). The package and/or data integrity may be com-
promised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
February 26, 2009 21533E6
Am29DL16xD
9
SPANSION [ SPANSION ]
