D A T A S H E E T
Revision E + 2 (February 14, 2003)
Revision E5 (December 1, 2006)
Global
Global
Added VBF048 package, Very Thin Profile Fine Pitch
Ball Grid Array, to Distinctive Characteristics, General
Description, Ordering Information, Connection Dia-
grams, and Physical Dimensions sections.
Changed SecSi to Secured Silicon.
Erase and Program Operations table
Changed tBUSY to a maximum specification.
Revision E+3 (February 25, 2004)
Revision E6 (February 26, 2009)
AC Characteristics
Global
Corrected tSR/W in Figure 20, Back-to-back Read/Write
Cycle Timings.
Added obsolescence information.
Revision E+4 (May 26, 2004)
Ordering Information
Added Pb-Free OPNs.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-
vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-
sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006-2009 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™,
ORNAND2™, HD-SIM™, EcoRAM™ and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used
are for informational purposes only and may be trademarks of their respective owners.
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