D A T A
S H E E T
48-Ball Very Thin Profile Fine-pitch BGA
Top View, Balls Facing Down
A6
A13
A5
A9
A4
WE#
A3
B6
A12
B5
A8
B4
RESET#
B3
C6
A14
C5
A10
C4
NC
C3
A18
C2
A6
C1
A2
D6
A15
D5
A11
D4
A19
D3
NC
D2
A5
D1
A1
E6
A16
E5
DQ7
E4
DQ5
E3
DQ2
E2
DQ0
E1
A0
F6
G6
H6
V
SS
H5
DQ6
H4
DQ4
H3
DQ3
H2
DQ1
H1
V
SS
BYTE# DQ15/A-1
F5
DQ14
F4
DQ12
F3
DQ10
F2
DQ8
F1
CE#
G5
DQ13
G4
V
CC
G3
DQ11
G2
DQ9
G1
OE#
RY/BY# WP#/ACC
A2
A7
A1
A3
B2
A17
B1
A4
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (BGA, TSOP, SO, PLCC,
PDIP). The package and/or data integrity may be com-
p r o m i s e d i f t h e p a ck a g e b o d y i s ex p o s e d t o
temperatures above 150°C for prolonged periods of
time.
February 26, 2009 21533E6
Am29DL16xD
9
SPANSION [ SPANSION ]
