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AM29BL802CB80DPI1 参数 Datasheet PDF下载

AM29BL802CB80DPI1图片预览
型号: AM29BL802CB80DPI1
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 512K的x 16位) CMOS 3.0伏只,连拍模式,引导扇区闪存裸片修订版1 [8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1]
分类和应用: 闪存
文件页数/大小: 17 页 / 292 K
品牌: SPANSION [ SPANSION ]
 浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第5页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第6页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第7页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第8页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第10页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第11页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第12页浏览型号AM29BL802CB80DPI1的Datasheet PDF文件第13页  
S U P P L E M E N T
PAD DESCRIPTION
Pads relative to die center.
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Signal
WE#
RESET#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
V
SS
Pad Center (mils)
X
Y
–3.11
–13.41
–23.34
–33.39
–43.44
–53.49
–63.54
–73.59
–83.64
–93.69
–102.32
–110.94
–119.57
–128.19
–128.19
–114.94
–106.36
–96.72
–88.15
–78.51
–69.94
–60.30
–51.74
–42.10
–34.48
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
Pad Center
(millimeters)
X
Y
–0.0790
–0.3406
–0.5929
–0.8482
–1.1034
–1.3587
–1.6140
–1.8692
–2.1245
–2.3798
–2.5988
–2.8179
–3.0370
–3.2560
–3.2560
–2.9194
–2.7015
–2.4566
–2.2391
–1.9941
–1.7766
–1.5317
–1.3141
–1.0692
–0.8758
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
Pad
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
Signal
CLK
BAA#
IND#
V
CC
V
CC
DQ4
DQ12
DQ5
DQ13
DQ6
DQ14
DQ7
DQ15
V
SS
NC
A16
A15
A14
A13
A12
A11
A10
A9
A8
V
CC
LBA#
Pad Center (mils)
X
Y
–24.43
–14.38
25.76
42.04
50.19
57.06
66.70
75.27
84.91
93.47
103.12
111.68
121.32
128.19
128.19
119.57
110.94
102.32
93.69
83.64
73.59
63.54
53.49
43.20
23.10
14.94
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
–94.14
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
98.18
Pad Center
(millimeters)
X
Y
–0.6205
–0.3653
0.6543
1.0678
1.2749
1.4493
1.6942
1.9118
2.1567
2.3742
2.6192
2.8367
3.0816
3.2560
3.2560
3.0370
2.8179
2.5988
2.3798
2.1245
1.8692
1.6140
1.3587
1.0972
0.5866
0.3795
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
–2.3912
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
2.4938
Note:
The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
8
Am29BL802C Known Good Die