S U P P L E M E N T
PHYSICAL SPECIFICATIONS
MANUFACTURING INFORMATION
Die dimensions . . . . . . . . . . . 269.7 mils x 214.2 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 6.85 mm x 5.44 mm
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Wafer Sort Test . . . . . . . . . . . . Sunnyvale, CA, USA,
. . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 µm
Bond Pad Size . . . . . . . . . . . . . . 3.74 mils x 3.74 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 µm x 95 µm
Manufacturing ID (Bottom Boot) . . . . . . . . . . . . 98H11
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS39LS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Pad Area Free of Passivation . . . . . . . . . .13.99 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Bond Pad Metalization. . . . . . . . . . . . . . . . . . . . Al/Cu
SPECIAL HANDLING INSTRUCTIONS
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Processing
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
DC OPERATING CONDITIONS
V
(Supply Voltage) . . . . . . . . . . . . . . .3.0 V to 3.6 V
CC
Operating Temperature
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
Super Extended . . . . . . . . . . . . –55°C to +145°C
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
DC PARAMETER EXCEPTIONS
The following specifications replace those given in the Am29BL802 data sheet (publication number 22371):
Parameter
Description
Test Conditions
CE#, RESET# = V ±0.3 V
Typ
Max
Unit
I
V
V
Standby Current (Note 3)
Standby Current During Reset
22
35
µA
CC3
CC4
CC
CC
CC
I
RESET# = V ± 0.3 V
22
35
µA
SS
(Note 3)
OE# = V
30
30
50
50
µA
µA
IH
Automatic Sleep Mode
(Notes 3, 4)
V
V
= V ± 0.3 V;
CC
IH
IL
I
CC5
= V ± 0.3 V
SS
OE# = V
IL
Notes:
3. Maximum I specifications are tested with V = V max.
CC
CC
CC
4. Automatic sleep mode enables the low power mode when addresses remain stable for t
+ 30 ns.
ACC
Am29BL802C Known Good Die
13
SPANSION [ SPANSION ]
