S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29BL802C
B
80R
DP
E
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
I
=
=
=
Industrial (–40°C to +85°C)
Extended (–55°C to +125°C)
Super Extended (–55°C to +145°C)
E
H
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
DG
DT
=
=
=
=
Waffle Pack
125 die per 5 tray stack
Gel-Pak® Die Tray
336 die per 6 tray stack
Surftape™ (Tape and Reel)
1600 per 7-inch reel
DW
Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
B
=
Bottom boot sector
DEVICE NUMBER/DESCRIPTION
Am29BL802C Known Good Die
8 Megabit (512 K x 16-Bit) CMOS Flash Memory—Die Revision 1
3.0 Volt-only Program and Erase
Valid Combinations
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.s
DPI 1, DPE 1, DPH 1
DGI 1, DGE 1, DGH 1
DTI 1, DTE 1, DTH 1
DWI 1, DWE 1, DWH 1
AM29BL802CB-80R
(30 pF loading)
10
Am29BL802C Known Good Die
SPANSION [ SPANSION ]
